Siemens PLM Software - NX Nastran/NX CAE Solutions Forum

Event Date: On Demand
Event Time: 60 minutes

Section 1 - Customer Presentation: ATA Engineering, Inc
Title: Electronics Cooling in Your Design Process
The NX Thermal and Flow solver environment allows the thermal/fluids analyst to influence products at any stage of the design. Part, FEM, simulation, and results workflows will be discussed.

Section 2 - Development Presentation: Random analysis with NX Nastran
This presentation will give an overview of Random Analysis using NX Nastran.

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Electronics Cooling in Your Design Process